Configurations include leaded, single-in-line, or dual-in-line lead-outs for through-board or surface mount applications, bare boards or flip-chip, all in a variety of shapes and sizes to suit each customer's requirements. Interconnects can be produced from a variety of metals to suit all types of applications, and through-hole connections can be made to each metalised side.

Hybrid circuits can be coated by a variety of conformal coatings such as polymers and epoxies, each exhibiting different properties from simple mechanical protection to full protection from harsh environments.